Journal of Materials Science: Materials in Electronics

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Journal of Materials Science: Materials in Electronics Journal

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Impact of La doping on the crystalline phase and mixed ionic-electronic conductivities of Ba0.5−xLa0.5+xFeO3−δ (0≤x≤0.3) solid solution. 34. 2023
An efficient and viable photodegradation of a textile Reactive yellow-86 dye under direct sunlight by multi-structured Fe2O3 encapsulated with phytochemicals of R. Indica. 31:21233-21247. 2020
A study on CdCl2 activation of CBD-CdS films. 31:13330-13336. 2020
Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications. 29:12669-12680. 2018
Synthesis of CoMn2O4 thin films on Ni foams by electrostatic spray deposition as anodes for sodium-ion batteries. 29:11404-11408. 2018
Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties. 28:18773-18780. 2017
RF inductors with sputtered nanomagnetic films on glass substrates. 28:15184-15194. 2017
Dielectric-electrode interactions in glass and silicon-compatible thin-film (Ba,Sr)TiO₃ capacitors. 28:595-600. 2017
Bandgap engineering of single layer graphene by randomly distributed nanoparticles. 27:7454-7459. 2016
CoY hexaferrite-PEEK composites for integrated and miniaturized RF components. 27:7010-7017. 2016
Cr modified Raman, optical band gap and magnetic properties of SnO₂ nanoparticles. 27:6020-6029. 2016
Low field room temperature magnetism and band gap modifications in Sm doped SnO₂. 27:3053-3064. 2016
Structure-magnetic property correlations in nickel-polymer nanocomposites. 27:154-162. 2016
Effect of Mn doping on structural, optical and magnetic properties of SnO₂ nanoparticles. 26:9571-9582. 2015
Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates. 25:1687-1695. 2014
Magnetic losses in metal nanoparticle-insulator nanocomposites. 24:3448-3455. 2013
Leakage current suppression in solution-deposited barium titanate films on copper foils. 23:901-908. 2012
Fabrication and characterization of novel silicon-compatible high-density capacitors. 23:528-535. 2012

International Standard Serial Number (ISSN)

0957-4522

Electronic International Standard Serial Number (EISSN)

1573-482X