Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications
Article
Demir, K, Sukumaran, V, Sato, Y et al. (2018). Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications
. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 29(15), 12669-12680. 10.1007/s10854-018-9384-6
Demir, K, Sukumaran, V, Sato, Y et al. (2018). Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications
. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 29(15), 12669-12680. 10.1007/s10854-018-9384-6
Glass is an ideal substrate material to enable 2.5D and 3D packaging of ICs at low cost and high performance. However, it is a brittle material and is prone to failures during fabrication and operation. Large coefficient of thermal expansion (CTE) mismatch between copper and glass leads to thermomechanical stresses that can lead to glass cracking and delamination from glass interfaces. This paper focuses on modeling and reliability characterization of copper-plated through-package-vias (TPV) in glass packages. Thermomechanical simulations were carried out to obtain design guidelines for reliable TPVs in glass. Test-vehicles with different glass thicknesses and copper TPV fabrication conditions were fabricated for thermal cycling tests, resistance monitoring and failure analysis. The reliability characterization results showed good thermomechanical reliability of TPVs in ultra-thin glass panels.
