Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications Article

Demir, Kaya, Sukumaran, Vijay, Sato, Yoichiro et al. (2018). Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications . JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 29(15), 12669-12680. 10.1007/s10854-018-9384-6

Industry Collaboration International Collaboration

cited authors

  • Demir, Kaya; Sukumaran, Vijay; Sato, Yoichiro; El Amrani, Abderrahim; Ramachandran, Koushik; Pucha, Raghuram; Raj, P Markondeya; Sundaram, Venkatesh; Tummala, Rao

authors

publication date

  • August 1, 2018

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • LAYERS
  • LOW-COST
  • Materials Science
  • Materials Science, Multidisciplinary
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Physics, Condensed Matter
  • SILICON VIAS
  • Science & Technology
  • THIN GLASS
  • Technology

Digital Object Identifier (DOI)

publisher

  • SPRINGER

start page

  • 12669

end page

  • 12680

volume

  • 29

issue

  • 15