Reticular Graphene Reinforced Copper for Electromagnetic Shielding Application Conference

Nisar, Ambreen, Al Duhni, Ghaleb, Zhang, Cheng et al. (2023). Reticular Graphene Reinforced Copper for Electromagnetic Shielding Application . 10.1109/3D-PEIM55914.2023.10052591

cited authors

  • Nisar, Ambreen; Al Duhni, Ghaleb; Zhang, Cheng; Raj, Pulugurtha Markondeya; Agarwal, Arvind

sustainable development goals

authors

date/time interval

  • February 1, 2023 -

publication date

  • January 1, 2023

keywords

  • Electromagnetic (EM) Shielding
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Graphene Foam (GrF)
  • Interface
  • Layered Structure
  • Metal Matrix Composites (MMCs)
  • Science & Technology
  • Spark Plasma Sintering (SPS)
  • Technology

Location

  • FL, Miami

Digital Object Identifier (DOI)

Conference

  • 4th International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

publisher

  • IEEE