Highly-Reliable, 30μm Pitch Copper Interconnects Using Nano-ACF/NCF Conference

Kumbhat, Nitesh, Choudhury, Abhishek, Raine, Melanie et al. (2009). Highly-Reliable, 30μm Pitch Copper Interconnects Using Nano-ACF/NCF . 1479-+. 10.1109/ECTC.2009.5074208

Industry Collaboration International Collaboration

cited authors

  • Kumbhat, Nitesh; Choudhury, Abhishek; Raine, Melanie; Mehrotra, Gaurav; Raj, P Markondeya; Zhang, Rongwei; Moon, Kyoung S; Chatterjee, Ritwik; Sundaram, Venky; Meyer-Berg, Georg; Wong, CP; Tummala, Rao R

authors

date/time interval

  • May 26, 2009 -

publication date

  • January 1, 2009

keywords

  • Computer Science
  • Computer Science, Hardware & Architecture
  • Computer Science, Theory & Methods
  • FLIP-CHIP
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • 59th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1479

end page

  • +