Solution-derived electrodes and dielectrics for low-cost and high-capacitance trench and Through-Silicon-Via (TSV) capacitors
Conference
Wang, Y, Xiang, S, Raj, PM et al. (2011). Solution-derived electrodes and dielectrics for low-cost and high-capacitance trench and Through-Silicon-Via (TSV) capacitors
. 1987-1991. 10.1109/ECTC.2011.5898789
Wang, Y, Xiang, S, Raj, PM et al. (2011). Solution-derived electrodes and dielectrics for low-cost and high-capacitance trench and Through-Silicon-Via (TSV) capacitors
. 1987-1991. 10.1109/ECTC.2011.5898789