Solution-Derived Electrodes and Dielectrics for Low-Cost and High-Capacitance Trench and Through-Silicon-Via (TSV) Capacitors Conference

Wang, Yushu, Xiang, Shu, Raj, P Markondeya et al. (2011). Solution-Derived Electrodes and Dielectrics for Low-Cost and High-Capacitance Trench and Through-Silicon-Via (TSV) Capacitors . 1987-1991.

Industry Collaboration

cited authors

  • Wang, Yushu; Xiang, Shu; Raj, P Markondeya; Sharm, Himani; Williams, Byron; Tummala, Rao

authors

date/time interval

  • May 31, 2011 -

publication date

  • January 1, 2011

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FATIGUE
  • Science & Technology
  • THIN-FILMS
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 61st Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1987

end page

  • 1991