Reliability of Through-Package-Vias From via-First Processing With Ultra-Thin Glass Article

Demir, Kaya, Ogawa, Tomonori, Sundaram, Venky et al. (2017). Reliability of Through-Package-Vias From via-First Processing With Ultra-Thin Glass . IEEE Transactions on Device and Materials Reliability, 17(4), 683-691. 10.1109/TDMR.2017.2752730

International Collaboration

cited authors

  • Demir, Kaya; Ogawa, Tomonori; Sundaram, Venky; Raj, P Markondeya; Tummala, Rao R

authors

publication date

  • December 1, 2017

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • Glass interposers
  • INTERPOSERS
  • LOW-COST
  • Physical Sciences
  • Physics
  • Physics, Applied
  • SILICON
  • Science & Technology
  • Technology
  • failure mechanism analysis
  • finite-element modeling
  • reliability
  • through package vias

Digital Object Identifier (DOI)

start page

  • 683

end page

  • 691

volume

  • 17

issue

  • 4