Design and Demonstration of Ultra-thin Glass 3D IPD Diplexers Conference

Wu, Zihan, Min, Junki, Kim, Minsuk et al. (2016). Design and Demonstration of Ultra-thin Glass 3D IPD Diplexers . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2348-2352. 10.1109/ECTC.2016.265

cited authors

  • Wu, Zihan; Min, Junki; Kim, Minsuk; Pulugurtha, Markondeya Raj; Sundaram, Venky; Tummala, Rao R

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • RF diplexer
  • Science & Technology
  • TPV
  • Technology
  • WLAN
  • embedded matching network
  • glass substrate
  • thinfilm

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 2348

end page

  • 2352