Self-healing of Interconnect Cracks for Reliable and Defect-Free Smart Manufacturing of Flexible Packages Conference

Hassan, Akeeb Yunus, Banerjee, Reshmi, Tomitaka, Asahi et al. (2022). Self-healing of Interconnect Cracks for Reliable and Defect-Free Smart Manufacturing of Flexible Packages . 1556-1561. 10.1109/ECTC51906.2022.00248

cited authors

  • Hassan, Akeeb Yunus; Banerjee, Reshmi; Tomitaka, Asahi; Raj, Pulugurtha Markondeya

authors

date/time interval

  • May 31, 2022 -

publication date

  • January 1, 2022

webpage

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • IRON-OXIDE NANOPARTICLES
  • Science & Technology
  • Technology
  • elastomer
  • flexible
  • interconnect
  • self-healing
  • silver

Location

  • San Diego, CA

Digital Object Identifier (DOI)

Conference

  • 72nd IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1556

end page

  • 1561