Silicon- And glass-integrated thinfilm power components Conference

Raj, PM, Sharma, H, Mishra, D et al. (2012). Silicon- And glass-integrated thinfilm power components . 229-238.

cited authors

  • Raj, PM; Sharma, H; Mishra, D; Chakraborti, P; Lei, S; Yang, I; Tummala, R

abstract

  • The trend towards ultra-miniaturized electronic and bioelectronics systems is driving the need for thin power modules (less than 200 microns) that can be embedded in 3D silicon and organic packages. Discrete power-supply capacitors and inductors are typically the largest components in a power module that prevent its miniaturization and thickness reduction. This limitation of discrete passives can be addressed with silicon- or glass-integrated thinfilm power-supply capacitors and inductors. These IPDs can then be assembled onto a package-interposer or embedded into a 3D IC or package for the thinnest power modules. However, current thinfilm technologies for inductors and capacitors cannot achieve the required volumetric density and power efficiency. A new set of thinfilm technologies with silicon- And glass-compatible processes are required to meet the target properties and component performance. This paper discusses two such key technologies that enable integration of power capacitors and inductors as thinfilms on silicon and glass substrates. The first part of the paper briefly describes silicon-integrated nanomagnetic composite films for power-supply inductors. Planar toroid inductors with an inductance density of 400 nH/mm2, current-handling of 1 Ampere, and high power efficiency were designed with this nanomagnetics technology, using a component thickness of 100 μm. The second part of the paper discusses of novel high surface-area nanoporous electrode technology with conformal dielectric for integration of high-density capacitors as thinfilms on silicon and glass with densities of 100 μF/cm2 using 100 μm thick films. A representative system consisting of copper electrodes with conformal alumina dielectric was demonstrated as a proof-ofconcept for this technology. ©(2012) by the Electronic Components Industry Association (ECIA).

publication date

  • December 1, 2012

International Standard Book Number (ISBN) 13

start page

  • 229

end page

  • 238