A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module Conference

Gandhi, S, Raj, PM, Sundaram, V et al. (2013). A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module . 1197-1203. 10.1109/ECTC.2013.6575727

cited authors

  • Gandhi, S; Raj, PM; Sundaram, V; Sharma, H; Swaminathan, M; Tummala, R

authors

abstract

  • This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with through-vias and double-side integration of ultra-thin active and passive components to form functional modules. By integrating power ICs, storage capacitors and inductors, and high-frequency decoupling capacitors in ultra-thin (30-100 μm) glass substrates, 3D IPAC Voltage Regulator Module (3D IPAC VRM) provides a complete and ultra-miniaturized solution to power integrity. The ultra-thin 3D IPAC allows both actives and passives very close to each other and to the other active dies, resulting in improved performance over conventional SMDs and state-of-art IPDs for decoupling functions. The first part of the paper presents modeling results to show the benefits of the 3D IPAC module as a power integrity solution. The second part of the paper presents the fabrication and characterization of high-k thinfilm capacitors and etched aluminum film capacitors integrated on either sides of a through-via 3D IPAC glass substrate. This paper, therefore, demonstrates the integration of heterogeneous capacitors on a single ultra-thin glass substrate for the first time, and presents its benefits as a complete solution for power integrity. © 2013 IEEE.

publication date

  • September 9, 2013

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 1197

end page

  • 1203