Packaging Materials in High-Performance Computing Applications Review

Pulugurtha, Markondeya Raj, Sharma, Himani, Pucha, Raghuram et al. (2022). Packaging Materials in High-Performance Computing Applications . Journal of the Indian Institute of Science, 102(1), 461-487. 10.1007/s41745-021-00282-w

cited authors

  • Pulugurtha, Markondeya Raj; Sharma, Himani; Pucha, Raghuram; Kathaperumal, Mohanalingam; Tummala, Rao

authors

publication date

  • January 1, 2022

published in

keywords

  • ADHESIVES
  • INTERCONNECTS
  • Multidisciplinary Sciences
  • RELIABILITY
  • SUBSTRATE
  • Science & Technology
  • Science & Technology - Other Topics
  • TRANSPORT
  • WAVE-GUIDES

Digital Object Identifier (DOI)

start page

  • 461

end page

  • 487

volume

  • 102

issue

  • 1