Accelerated SLID Bonding Using Thin Multi-layer Copper-Solder Stack for Fine-pitch Interconnections Conference

Honrao, Chinmay, Huang, Ting-Chia, Kobayashi, Makoto et al. (2014). Accelerated SLID Bonding Using Thin Multi-layer Copper-Solder Stack for Fine-pitch Interconnections . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1160-1165.

International Collaboration

cited authors

  • Honrao, Chinmay; Huang, Ting-Chia; Kobayashi, Makoto; Smet, Vanessa; Raj, P Markondeya; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1160

end page

  • 1165