High density packaging in 2010 and beyond Conference

Tummala, RR, Sundaram, V, Liu, FH et al. (2002). High density packaging in 2010 and beyond . 30-36. 10.1109/EMAP.2002.1188809

cited authors

  • Tummala, RR; Sundaram, V; Liu, FH; White, G; Bhattacharya, S; Pulugurtha, RM; Swaminathan, M; Dalmia, S; Laskar, J; Jokerst, NM; Chow, SY

authors

date/time interval

  • December 4, 2002 -

publication date

  • January 1, 2002

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Science & Technology
  • Technology

Location

  • TAIWAN, KAOHSIUNG

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 4th International Symposium on Electronic Materials and Packaging

publisher

  • IEEE

start page

  • 30

end page

  • 36