Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-situ stress measurements using Raman spectroscopy Conference

Demir, Kaya, Sundaram, Venky, Raj, P Markondeya et al. (2016). Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-situ stress measurements using Raman spectroscopy . 799-805. 10.1109/ECTC.2016.315

International Collaboration

cited authors

  • Demir, Kaya; Sundaram, Venky; Raj, P Markondeya; Tummala, Rao; Benali, Abdellah

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Raman spectroscopy
  • Science & Technology
  • Technology
  • Through package via (TPV)
  • glass interposer
  • reliability
  • thermal cycling test

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 799

end page

  • 805