Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections
Conference
Mishra, D, Raj, PM, Khan, S et al. (2011). Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections
. 916-920. 10.1109/ECTC.2011.5898621
Mishra, D, Raj, PM, Khan, S et al. (2011). Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections
. 916-920. 10.1109/ECTC.2011.5898621