Co-W as an Advanced Barrier for Intermetallics and Electromigration in Fine-Pitch Flipchip Interconnections Conference

Mishra, Dibyajat, Raj, P Markondeya, Khan, Sadia et al. (2011). Co-W as an Advanced Barrier for Intermetallics and Electromigration in Fine-Pitch Flipchip Interconnections . 916-920.

cited authors

  • Mishra, Dibyajat; Raj, P Markondeya; Khan, Sadia; Kumbhat, Nitesh; Wang, Yushu; Addya, Suman; Pucha, Raghuram V; Choudhury, Abhishek; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 31, 2011 -

publication date

  • January 1, 2011

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FAILURE
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 61st Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 916

end page

  • 920