Ultra-Thin and Ultra-high I/O Density Package-on-Package (3D Thin PoP) for High Bandwidth of Smart Systems Conference

Kim, Sung Jin, Honrao, Chinmay, Raj, P Markondeya et al. (2013). Ultra-Thin and Ultra-high I/O Density Package-on-Package (3D Thin PoP) for High Bandwidth of Smart Systems . 406-411.

cited authors

  • Kim, Sung Jin; Honrao, Chinmay; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 28, 2013 -

publication date

  • January 1, 2013

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Conference

  • IEEE 63rd Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 406

end page

  • 411