Large silicon, glass and low CTE organic interposers to printed wiring board SMT interconnections using copper microwire arrays
Conference
Qin, X, Gottschall, S, Kumbhat, N et al. (2013). Large silicon, glass and low CTE organic interposers to printed wiring board SMT interconnections using copper microwire arrays
. 867-871. 10.1109/ECTC.2013.6575675
Qin, X, Gottschall, S, Kumbhat, N et al. (2013). Large silicon, glass and low CTE organic interposers to printed wiring board SMT interconnections using copper microwire arrays
. 867-871. 10.1109/ECTC.2013.6575675