Large Silicon, Glass and Low CTE Organic Interposers to Printed Wiring Board SMT Interconnections using Copper Microwire Arrays Conference

Qin, Xian, Gottschall, Sebastian, Kumbhat, Nitesh et al. (2013). Large Silicon, Glass and Low CTE Organic Interposers to Printed Wiring Board SMT Interconnections using Copper Microwire Arrays . 867-871.

cited authors

  • Qin, Xian; Gottschall, Sebastian; Kumbhat, Nitesh; Raj, P Markondeya; Kim, Sungjin; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 28, 2013 -

publication date

  • January 1, 2013

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Conference

  • IEEE 63rd Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 867

end page

  • 871