Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and Modules for Broadband 5G Applications Conference

Lin, Tong-Hong, Bahr, Ryan A, Tentzeris, Manos M et al. (2018). Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and Modules for Broadband 5G Applications . 214-220. 10.1109/ECTC.2018.00041

cited authors

  • Lin, Tong-Hong; Bahr, Ryan A; Tentzeris, Manos M; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

keywords

  • 3D printing
  • 5G
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • broadband
  • flexible
  • inkjet printing
  • mm-wave
  • packaging

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 214

end page

  • 220