New package/board materials technology for next-generation convergent microsystems Conference

Kumbhat, N, Raj, PM, Bansal, S et al. (2003). New package/board materials technology for next-generation convergent microsystems . 331-335.

cited authors

  • Kumbhat, N; Raj, PM; Bansal, S; Doraiswami, R; Bhattacharya, S; Tummala, R; Hayes, S; Atmur, S

authors

date/time interval

  • December 10, 2003 -

publication date

  • January 1, 2003

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • SINGAPORE, Singapore

International Standard Book Number (ISBN) 10

Conference

  • 5th Electronics Packaging Technology Conference (EPTC 2003)

publisher

  • IEEE

start page

  • 331

end page

  • 335