Evaluation of alternative materials for system-on-package (SOP) substrates Article

Shinotani, KI, Raj, PM, Seo, M et al. (2004). Evaluation of alternative materials for system-on-package (SOP) substrates . IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 27(4), 694-701. 10.1109/TCAPT.2004.838906

Industry Collaboration International Collaboration

cited authors

  • Shinotani, KI; Raj, PM; Seo, M; Bansal, S; Sakurai, H; Bhattacharya, SK; Tummala, R

authors

publication date

  • December 1, 2004

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • FR4
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • board
  • dielectric
  • flip chip
  • reliability
  • underfill
  • warpage

Location

  • FRANCE, Aix en Provence

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 694

end page

  • 701

volume

  • 27

issue

  • 4