IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Journal

publication venue for

Lead-free solder films via novel solution synthesis routes. 30:486-493. 2007
Evaluation of alternative materials for system-on-package (SOP) substrates. 27:694-701. 2004
Integrating high-k ceramic thin film capacitors into organic substrates via low-cost solution processing 2007
Processing and dielectric properties of nanocomposite thin film "supercapacitors" for high-frequency embedded decoupling 2007

International Standard Serial Number (ISSN)

1521-3331