Integrating high-k ceramic thin film capacitors into organic substrates via low-cost solution processing Conference

Raj, P Markondeya, Balaraman, Devarajan, Abothu, Isaac Robin et al. (2007). Integrating high-k ceramic thin film capacitors into organic substrates via low-cost solution processing . IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 30(4), 585-594. 10.1109/TCAPT.2007.901737

Industry Collaboration International Collaboration

cited authors

  • Raj, P Markondeya; Balaraman, Devarajan; Abothu, Isaac Robin; Yoon, Chong; Kang, Nam-Kee; Tummala, Rao

sustainable development goals

authors

date/time interval

  • May 31, 2005 -

publication date

  • December 1, 2007

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • HIGH-DIELECTRIC-CONSTANT
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • capacitors
  • decoupling
  • embedded
  • hydrothermal
  • organic
  • sol-gel

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • 55th Electronic Components and Technology Conference

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 585

end page

  • 594

volume

  • 30

issue

  • 4