Lead-free solder films via novel solution synthesis routes Article

Aggarwal, Ankur I, Abothu, Isaac R, Raj, R Markondeya et al. (2007). Lead-free solder films via novel solution synthesis routes . IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 30(3), 486-493. 10.1109/TCAPT.2007.900062

Industry Collaboration

cited authors

  • Aggarwal, Ankur I; Abothu, Isaac R; Raj, R Markondeya; Sacks, Michael D; Tummala, Rao R

authors

publication date

  • September 1, 2007

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Sn-Ag films
  • Technology
  • integrated circuits (ICs)
  • laminates

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 486

end page

  • 493

volume

  • 30

issue

  • 3