Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-thin Low-CTE Package Assemblies Conference

Jayaram, Vidya, McCann, Scott, Huang, Ting-Chia et al. (2016). Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-thin Low-CTE Package Assemblies . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 101-107. 10.1109/ECTC.2016.384

International Collaboration

cited authors

  • Jayaram, Vidya; McCann, Scott; Huang, Ting-Chia; Pulugurtha, Raj; Smet, Vanessa; Tummala, Rao; Kawamoto, Satomi

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

published in

keywords

  • ANAND MODEL
  • Cu pillar
  • Engineering
  • Engineering, Electrical & Electronic
  • MOIRE
  • Science & Technology
  • Technology
  • finite-element simulation
  • low-CTE packages
  • reliability
  • thermocompression bonding
  • warpage

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 101

end page

  • 107