Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure Article

Kim, Youngwoo, Park, Gapyeol, Cho, Kyungjun et al. (2020). Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure . IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 68(12), 5055-5064. 10.1109/TMTT.2020.3022009

Industry Collaboration International Collaboration

cited authors

  • Kim, Youngwoo; Park, Gapyeol; Cho, Kyungjun; Raj, Pulugurtha Markondeya; Tummala, Rao R; Kim, Joungho

authors

publication date

  • December 1, 2020

published in

keywords

  • DESIGN
  • Double-sided (DS)
  • Engineering
  • Engineering, Electrical & Electronic
  • HIGH-BANDWIDTH
  • PACKAGE
  • SILICON
  • Science & Technology
  • Technology
  • VIAS
  • electromagnetic bandgap (EBG)
  • glass interposer (GI)
  • ground noise
  • power
  • through glass via (TGV)

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 5055

end page

  • 5064

volume

  • 68

issue

  • 12