Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure Article

Kim, Y, Park, G, Cho, K et al. (2020). Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure . IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 68(12), 5055-5064. 10.1109/TMTT.2020.3022009

cited authors

  • Kim, Y; Park, G; Cho, K; Raj, PM; Tummala, RR; Kim, J

abstract

  • In this article, we propose a double-sided electromagnetic bandgap (DS-EBG) structure for glass interposers (GIs) with low substrate loss to suppress power/ground noise. For the first time, we validated wideband power/ground noise suppression in the GI using the proposed DS-EBG structure based on dispersion analysis and experimental verification. We experimentally verified that the proposed DS-EBG structure achieved the power/ground noise suppression (below -40 dB) between 2.5 and 8.9 GHz in the GI. Derived stopband edges, $f_{L}$ and $f_{U}$ based on the dispersion analysis, and 3-D electromagnetic (EM) simulation showed a good correlation with measurements. The effectiveness of the proposed DS-EBG structure on the power/ground noise suppression is verified by analyzing noise propagation in the power distribution network and coupling to the GI channel. Using the 3-D EM simulation, we verified that the proposed DS-EBG structure suppressed the power/ground noise coupling and improved the eye diagram of the GI channel. Finally, we propose a design methodology to broaden the isolation bandgap or miniaturize the dimensions based on the dispersion analysis.

publication date

  • December 1, 2020

Digital Object Identifier (DOI)

start page

  • 5055

end page

  • 5064

volume

  • 68

issue

  • 12