Ultraminiaturized Three-Dimensional IPAC Packages with 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
Article
Wu, Z, Min, J, Smet, V et al. (2017). Ultraminiaturized Three-Dimensional IPAC Packages with 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
. JOURNAL OF ELECTRONIC PACKAGING, 139(4), 10.1115/1.4037221
Wu, Z, Min, J, Smet, V et al. (2017). Ultraminiaturized Three-Dimensional IPAC Packages with 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
. JOURNAL OF ELECTRONIC PACKAGING, 139(4), 10.1115/1.4037221
This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.
