Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules Article

Wu, Zihan, Min, Junki, Smet, Vanessa et al. (2017). Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules . JOURNAL OF ELECTRONIC PACKAGING, 139(4), 10.1115/1.4037221

cited authors

  • Wu, Zihan; Min, Junki; Smet, Vanessa; Pulugurtha, Markondeya Raj; Sundaram, Venky; Tummala, Rao R

authors

publication date

  • December 1, 2017

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Mechanical
  • SYSTEM
  • Science & Technology
  • TECHNOLOGY
  • Technology
  • WIRELESS
  • embedding
  • filters
  • front end
  • ultrathin glass

Digital Object Identifier (DOI)

publisher

  • ASME

volume

  • 139

issue

  • 4