JOURNAL OF ELECTRONIC PACKAGING

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JOURNAL OF ELECTRONIC PACKAGING Journal

publication venue for

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules. 139. 2017
Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots. 137. 2015
Determination of temperatures and heat fluxes on surfaces and interfaces of multidomain three-dimensional electronic components. 126:457-464. 2004

category

ENGINEERING, ELECTRICAL & ELECTRONIC Category
ENGINEERING, MECHANICAL Category

International Standard Serial Number (ISSN)

1043-7398

Electronic International Standard Serial Number (EISSN)

1528-9044