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JOURNAL OF ELECTRONIC PACKAGING
Journal
Overview
Research
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Other
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Overview
publication venue for
Ultraminiaturized Three-Dimensional IPAC Packages with 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
. 139.
2017
Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots
. 137.
2015
Determination of temperatures and heat fluxes on surfaces and interfaces of multidomain three-dimensional electronic components
. 126:457-464.
2004
Research
category
ENGINEERING, ELECTRICAL & ELECTRONIC
Category
ENGINEERING, MECHANICAL
Category
Identifiers
International Standard Serial Number (ISSN)
1043-7398
Electronic International Standard Serial Number (EISSN)
1528-9044
Other
journal abbreviation
J ELECTRON PACKAGING
