Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots Article

Abdoli, Abas, Dulikravich, George S, Vasquez, Genesis et al. (2015). Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots . JOURNAL OF ELECTRONIC PACKAGING, 137(3), 10.1115/1.4030005

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Mechanical
  • HEAT SINK
  • SILICON
  • Science & Technology
  • Technology
  • electronics cooling
  • hot spot
  • single phase flow microchannel

Digital Object Identifier (DOI)

publisher

  • ASME

volume

  • 137

issue

  • 3