Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs Article

Bhardwaj, Shubhendu, Sayeed, SK Yeahia Been, Camara, Jose Solis et al. (2019). Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs . 2019(1), 000434-000437. 10.4071/2380-4505-2019.1.000434

cited authors

  • Bhardwaj, Shubhendu; Sayeed, SK Yeahia Been; Camara, Jose Solis; Vital, Dieff; Raj, PM

authors

publication date

  • October 1, 2019

keywords

  • 40 Engineering
  • 4006 Communications Engineering
  • 4009 Electronics, Sensors and Digital Hardware

Digital Object Identifier (DOI)

publisher

  • IMAPS - International Microelectronics Assembly and Packaging Society

start page

  • 000434

end page

  • 000437

volume

  • 2019

issue

  • 1