Modeling, Design, and Demonstration of Low-temperature Cu Interconnections to Ultra-thin Glass Interposers at 20 μm Pitch Conference

Wang, Tao, Smet, Vanessa, Kobayashi, Makoto et al. (2014). Modeling, Design, and Demonstration of Low-temperature Cu Interconnections to Ultra-thin Glass Interposers at 20 μm Pitch . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 284-289.

International Collaboration

cited authors

  • Wang, Tao; Smet, Vanessa; Kobayashi, Makoto; Sundaram, Venky; Raj, P Markondeya; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

published in

keywords

  • AU
  • DIFFUSION
  • Engineering
  • Engineering, Electrical & Electronic
  • GOLD
  • PLASTIC-DEFORMATION
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 284

end page

  • 289