Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech Conference

Tummala, R, Wolter, KJ, Sundaram, V et al. (2016). Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech .

cited authors

  • Tummala, R; Wolter, KJ; Sundaram, V; Smet, V; Raj, PM

abstract

  • The new trends in automotive electronics such as autonomous driving, in-car smartphone-like infotainment, privacy and security, and all electric cars, require an entirely different vision than is pursued today. Georgia Tech sees unprecedented challenges and opportunities to address these needs because of disparate set of technologies that hitherto fore thought to be impossible to integrate. It proposes a systematic approach to system scaling, heterogeneous integration and innovative package architectures as the new era in electronics hardware with particular focus in electrical, mechanical and thermal designs and new digital, RF, sensors, millimeter wave and power technologies. The Georgia Tech team proposes a transformative and yet a strategic approach to automotive electronics, called System Scaling, leading to entire automotive system-on-A package. Such a system must integrate many disparate technologies such as high speed digital, optical, RF and wireless sensing and data processing from 100s of sensors as well as ultrahigh power electronics. Georgia Tech proposes a highly innovative large panel-based, ultra-Thin glass packaging in 3D double-side architecture with many, many innovations in designs, materials, processes, wiring lithography, fine-pitch and highly conductive through-vias for thermal management and system integration. Such an approach is proposed to lead to highly-functional systems with disparate set of technologies at lowest cost, in smallest ultra-miniaturized size with shortest interconnections with lowest power consumption. Georgia Tech views this approach to be superior to current approaches such as chip-first or wafer fanout or chip-last organic, leadframe and molded packaging technologies.

publication date

  • January 25, 2016

International Standard Book Number (ISBN) 13