Industry Consortium for New Era of Automotive Electronics with Entire System-on-Package Vision at Georgia Tech Conference

Tummala, Rao, Wolter, Klaus-Juergen, Sundaram, Venky et al. (2015). Industry Consortium for New Era of Automotive Electronics with Entire System-on-Package Vision at Georgia Tech . EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE

cited authors

  • Tummala, Rao; Wolter, Klaus-Juergen; Sundaram, Venky; Smet, Vanessa; Raj, Pulugurtha M

authors

date/time interval

  • September 14, 2015 -

publication date

  • January 1, 2015

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • GERMANY, Friedrichshafen

Conference

  • 20th European Microelectronics Packaging Conference And Exhibition (EMPC)

publisher

  • IEEE