Component-Level Shielding with Assembled Copper Trenches in Package Slots Conference

Al Duhni, Ghaleb, Khasgiwala, Mudit, Volakis, John L et al. (2023). Component-Level Shielding with Assembled Copper Trenches in Package Slots . 38-42. 10.1109/SoutheastCon51012.2023.10115102

cited authors

  • Al Duhni, Ghaleb; Khasgiwala, Mudit; Volakis, John L; Raj, Pulugurtha Markondeya

authors

date/time interval

  • April 1, 2023 -

publication date

  • January 1, 2023

keywords

  • Computer Science
  • Computer Science, Artificial Intelligence
  • Computer Science, Interdisciplinary Applications
  • Electromagnetic interference
  • MIMO
  • Science & Technology
  • Shielding effectiveness
  • Technology

Location

  • FL, Orlando

Conference

  • IEEE SoutheastCon Conference

publisher

  • IEEE

start page

  • 38

end page

  • 42