Infusing inorganics into the subsurface of polymer redistribution layer dielectrics for improved adhesion to metal interconnects Conference

Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Leng, Collen Z et al. (2017). Infusing inorganics into the subsurface of polymer redistribution layer dielectrics for improved adhesion to metal interconnects . 150-155. 10.1109/ECTC.2017.277

cited authors

  • Dwarakanath, Shreya; Raj, Pulugurtha Markondeya; Leng, Collen Z; Sundaram, Venky; Losego, Mark D; Tummala, Rao

authors

date/time interval

  • May 30, 2017 -

publication date

  • January 1, 2017

keywords

  • Adhesion
  • Engineering
  • Engineering, Electrical & Electronic
  • High-temperature
  • Re-Distribution-Layer (RDL)
  • Science & Technology
  • Technology
  • Vapor-Phase-Infiltration (VPI)
  • automotive electronics
  • dielectrics

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • IEEE 67th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 150

end page

  • 155