Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals Interconnects
Conference
Dwarakanath, S, Raj, PM, Leng, CZ et al. (2017). Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals Interconnects
. 150-155. 10.1109/ECTC.2017.277
Dwarakanath, S, Raj, PM, Leng, CZ et al. (2017). Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals Interconnects
. 150-155. 10.1109/ECTC.2017.277
This paper demonstrates a new class of inorganic-organic hybrid dielectric materials to address the requirements for high-temperature reliability of next-generation high-density, high-power packages and electronics in harsh environments for automotive applications. A major concern for reliability is the inadequate adhesion of metals with high-temperature polymers. Adhesion deteriorates further via thermal and oxidative exposure and moisture absorption. In this paper, a novel vapor phase infiltration (VPI) technique is applied to create an organic-inorganic hybrid dielectric surface that improves metal-polymer adhesion. The VPI process infuses inorganic constituents to a depth of at least 3 microns, as revealed by elemental analysis using SEM-EDX and XPS depth profiles. In preliminary testing, Cu/Cr films deposited onto these modified polymer surfaces exhibit 3x higher peel strength than metal films deposited on untreated polymer.
