3D IPAC - A New Passives and Actives Concept for Ultra-miniaturized Electronic and Bioelectronic Functional Modules Conference

Raj, P Markondeya, Jow, Uei-Ming, Dai, Jinxiang et al. (2013). 3D IPAC - A New Passives and Actives Concept for Ultra-miniaturized Electronic and Bioelectronic Functional Modules . 517-522.

cited authors

  • Raj, P Markondeya; Jow, Uei-Ming; Dai, Jinxiang; Murali, KP; Sharma, Himani; Mishra, Dibyajat; Xiao, T Danny; Gandhi, Saumya; Ghovanloo, Maysam; Tummala, Rao

authors

date/time interval

  • May 28, 2013 -

publication date

  • January 1, 2013

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Conference

  • IEEE 63rd Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 517

end page

  • 522