Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications Conference

Watanabe, Atom O, Ali, Muhammad, Zhang, Rui et al. (2020). Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 89-94. 10.1109/ECTC32862.2020.00027

International Collaboration

cited authors

  • Watanabe, Atom O; Ali, Muhammad; Zhang, Rui; Ravichandran, Siddharth; Kakutani, Takenori; Raj, P Markondeya; Tummala, Rao R; Swaminathan, Madhavan

authors

date/time interval

  • June 3, 2020 -

publication date

  • January 1, 2020

published in

keywords

  • 5G communications
  • Antenna in package
  • Embedding
  • Engineering
  • Engineering, Electrical & Electronic
  • Fan out
  • Glass substrate
  • Millimeter wave
  • Science & Technology
  • Technology

Location

  • ELECTR NETWORK

Digital Object Identifier (DOI)

Conference

  • 70th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 89

end page

  • 94