In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill Conference

Bansal, S, Raj, PM, Shinotani, K et al. (2003). In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill . 148-155. 10.1109/ECTC.2003.1216270

cited authors

  • Bansal, S; Raj, PM; Shinotani, K; Bhattacharya, S; Tummala, R; Lance, MJ

authors

date/time interval

  • May 27, 2003 -

publication date

  • January 1, 2003

keywords

  • Computer Science
  • Computer Science, Information Systems
  • Engineering
  • Engineering, Electrical & Electronic
  • Optics
  • Physical Sciences
  • Science & Technology
  • Technology

Location

  • LA, NEW ORLEANS

Digital Object Identifier (DOI)

Conference

  • 53rd Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 148

end page

  • 155