Reliability of nano-structured nickel interconnections replacing flipchip solder assembly without underfill Conference

Aggarwal, Ankur, Raj, P Markondeya, Lee, Baik-Woo et al. (2007). Reliability of nano-structured nickel interconnections replacing flipchip solder assembly without underfill . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 905-+. 10.1109/ECTC.2007.373906

cited authors

  • Aggarwal, Ankur; Raj, P Markondeya; Lee, Baik-Woo; Yim, Myung Jin; Tambawala, Abdemanaf; Iyer, Mahadevan; Swarninathan, Madhavan; Wong, CP; Tummala, Rao

authors

date/time interval

  • January 1, 2007 -

publication date

  • January 1, 2007

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Characterization & Testing
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • NV, Reno

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • 57th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 905

end page

  • +