Design and fabrication of high aspect ratio fine pitch interconnects for wafer level packaging Conference

Aggarwal, AO, Raj, PM, Pratap, RJ et al. (2002). Design and fabrication of high aspect ratio fine pitch interconnects for wafer level packaging . 229-234.

cited authors

  • Aggarwal, AO; Raj, PM; Pratap, RJ; Saxena, A; Tummala, RR

authors

date/time interval

  • December 10, 2002 -

publication date

  • January 1, 2002

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Optics
  • Physical Sciences
  • Physics
  • Physics, Condensed Matter
  • Science & Technology
  • Technology
  • Thermodynamics

Location

  • SINGAPORE, SINGAPORE

International Standard Book Number (ISBN) 10

Conference

  • 4th Electronics Packaging Technology Conference (EPTC 2002)

publisher

  • IEEE

start page

  • 229

end page

  • 234