Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly
Conference
Huang, TC, Smet, V, Kawamoto, S et al. (2015). Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly
. 2015-July 1377-1384. 10.1109/ECTC.2015.7159777
Huang, TC, Smet, V, Kawamoto, S et al. (2015). Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly
. 2015-July 1377-1384. 10.1109/ECTC.2015.7159777
Advances in high-performance package with high I/O densities, and power modules with escalating current needs are driving the need for a new class of interconnection technologies, with thermal stability, current-carrying capability and pitch scalability beyond that of traditional solders. Solid-liquid interdiffusion (SLID or SoLID) or transient liquid phase (TLP) bonding systems, in which the bonding layer is fully converted to intermetallics, are highly sought after to extend the applicability of solders to pitches below 30μm, and for die-attachment in high-temperature high-power systems. This paper introduces an innovative SLID concept, consisting of isolating a metastable intermetallic phase between barrier layers for a faster conversion to metastable composition than that in traditional SLID. The Cu-Sn system was used for this demonstration with a designed transition to metastable Cu6Sn5 instead of the stable Cu3Sn phase, usually targeted. The novel interconnection structure enables assembly within seconds and improved thermomechanical reliability, with all the benefits of SLID bonding such as outstanding thermal stability over 10x reflow and enhanced power handling capability with a current density of 105 A/cm2. The paper first describes the design and fabrication of the interconnection structure, including the barrier and bonding layers based on diffusion and thermomechanical modeling. Ultra-fast assembly by low-pressure thermocompression bonding was demonstrated on die-attach joints and interconnections at 100μm pitch, followed by extensive reliability characterization, including thermal stability evaluation, electromigration test, and die-shear test. The designed interconnections successfully passed JEDEC standards, qualifying this novel interconnection technology for high-temperature, high-power operations at fine-pitch.
