Modeling, Design and Demonstration of Ultra-short and Ultra-fine Pitch Metastable Cu-Sn Interconnections with High-throughput SLID Assembly Conference

Huang, Ting-Chia, Smet, Vanessa, Kawamoto, Satomi et al. (2015). Modeling, Design and Demonstration of Ultra-short and Ultra-fine Pitch Metastable Cu-Sn Interconnections with High-throughput SLID Assembly . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1377-1384.

International Collaboration

cited authors

  • Huang, Ting-Chia; Smet, Vanessa; Kawamoto, Satomi; Sundaram, Venky; Raj, P Markondeya; Tummala, Rao R

authors

date/time interval

  • May 26, 2015 -

publication date

  • January 1, 2015

published in

keywords

  • CU6SN5
  • Computer Science
  • Computer Science, Theory & Methods
  • DIFFUSION
  • Engineering
  • Engineering, Electrical & Electronic
  • GROWTH
  • INTERMETALLIC COMPOUNDS
  • KINETICS
  • SOLDER
  • SYSTEM
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • IEEE 65th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1377

end page

  • 1384