Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needs Article

Banerji, S, Raj, PM, Bhattacharya, S et al. (2005). Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needs . IEEE TRANSACTIONS ON ADVANCED PACKAGING, 28(1), 102-113. 10.1109/TADVP.2004.841665

cited authors

  • Banerji, S; Raj, PM; Bhattacharya, S; Tummala, RR

authors

publication date

  • February 1, 2005

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • FR4
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • global interconnects
  • high-density wiring
  • misregistration
  • printed wiring board (PWB)
  • routing
  • warpage

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 102

end page

  • 113

volume

  • 28

issue

  • 1