IEEE TRANSACTIONS ON ADVANCED PACKAGING

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IEEE TRANSACTIONS ON ADVANCED PACKAGING Journal

publication venue for

FDTD Schemes With Minimal Numerical Dispersion. 32:199-204. 2009
Novel ceramic composite substrates for high-density and high reliability packaging. 30:641-653. 2007
Metal-polymer composite interconnections for ultra fine-pitch wafer level packaging. 30:384-392. 2007
Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needs. 28:102-113. 2005
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade. 27:250-267. 2004
Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications. 26:10-16. 2003

International Standard Serial Number (ISSN)

1521-3323

journal abbreviation

IEEE T ADV PACKAGING