Novel ceramic composite substrates for high-density and high reliability packaging Article

Kumbhat, Nitesh, Raj, P Markondeya, Pucha, Raghuram V et al. (2007). Novel ceramic composite substrates for high-density and high reliability packaging . IEEE TRANSACTIONS ON ADVANCED PACKAGING, 30(4), 641-653. 10.1109/TADVP.2007.908027

cited authors

  • Kumbhat, Nitesh; Raj, P Markondeya; Pucha, Raghuram V; Tsai, Jui-Yun; Atmur, Steve; Bongio, Edward; Sitaraman, Suresh K; Tummala, Rao R

authors

publication date

  • November 1, 2007

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • MICROVIA
  • Materials Science
  • Materials Science, Multidisciplinary
  • SOP
  • Science & Technology
  • Technology
  • interconnections
  • microvia
  • modeling
  • packaging
  • reliability
  • solder joint
  • substrates

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 641

end page

  • 653

volume

  • 30

issue

  • 4