Novel ceramic composite substrates for high-density and high reliability packaging Article

Kumbhat, N, Raj, PM, Pucha, RV et al. (2007). Novel ceramic composite substrates for high-density and high reliability packaging . IEEE TRANSACTIONS ON ADVANCED PACKAGING, 30(4), 641-653. 10.1109/TADVP.2007.908027

cited authors

  • Kumbhat, N; Raj, PM; Pucha, RV; Tsai, JY; Atmur, S; Bongio, E; Sitaraman, SK; Tummala, RR

authors

abstract

  • This paper presents the development and evaluation of a large-area Carbon-Silicon Carbide (C-SiC) based composite board material that has the advantages of organic boards in terms of large-area processability and machinability at potentially low-cost while retaining the high stiffness (> 200 GPa) and Si-matched coefficient of thermal expansion (CTE) (∼ 2.5 ppm/°C) of ceramics. Test vehicles were fabricated using C-SiC boards for assessing ultra-fine pitch solder joint reliability without underfill as well as the reliability of high-density wiring with microvias on the board. Finite element reliability models were developed to simulate the thermomechanical behavior of test vehicles. From the finite-element simulations as well as accelerated reliability tests, the high stiffness low-CTE C-SiC boards did not show any premature solder joint fatigue failure or dielectric cracking. Furthermore, the C-SiC boards show minimal via-pad misalignment and support the multilayer buildup structure required to achieve very high wiring density. The modeling and experimental results suggest that the low-cost large-area ceramic matrix composite (C-SiC) has superior thermomechanical properties, and is, therefore, a promising candidate substrate material for the emerging microelectronic systems. © 2007 IEEE.

publication date

  • November 1, 2007

published in

Digital Object Identifier (DOI)

start page

  • 641

end page

  • 653

volume

  • 30

issue

  • 4