Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications Article

Windlass, H, Raj, PM, Balaraman, D et al. (2003). Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications . IEEE TRANSACTIONS ON ADVANCED PACKAGING, 26(1), 10-16. 10.1109/TADVP.2003.811369

cited authors

  • Windlass, H; Raj, PM; Balaraman, D; Bhattacharya, SK; Tummala, RR

sustainable development goals

authors

publication date

  • February 1, 2003

published in

keywords

  • DIELECTRIC-PROPERTIES
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • SOP
  • Science & Technology
  • Technology
  • capacitors
  • integral passives
  • nanocomposites

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 10

end page

  • 16

volume

  • 26

issue

  • 1