The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade Article

Tummala, RR, Swaminathan, M, Tentzeris, MM et al. (2004). The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade . IEEE TRANSACTIONS ON ADVANCED PACKAGING, 27(2), 250-267. 10.1109/TADVP.2004.830353

cited authors

  • Tummala, RR; Swaminathan, M; Tentzeris, MM; Laskar, J; Chang, GK; Sitaraman, S; Keezer, D; Guidotti, D; Huang, ZR; Lim, K; Wan, LX; Bhattacharya, SK; Sundaram, V; Liu, FH; Raj, PM

authors

publication date

  • May 1, 2004

published in

keywords

  • CHIP
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • OPTICAL INTERCONNECTIONS
  • PERFORMANCE
  • RF SOP
  • SIP
  • SOP
  • Science & Technology
  • Technology
  • antennas
  • detectors
  • digital system-on-package (SOP)
  • electromagnetic interference (EMI)
  • embedded components
  • embedded passives
  • embedded waveguides
  • microvia
  • mixed signal design
  • optical SOP
  • power integrity
  • reliability
  • signal integrity
  • switches
  • test

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 250

end page

  • 267

volume

  • 27

issue

  • 2