Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages Conference

Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Agarwal, Amit et al. (2019). Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages . 718-725. 10.1109/ECTC.2019.00114

Industry Collaboration International Collaboration

cited authors

  • Dwarakanath, Shreya; Raj, Pulugurtha Markondeya; Agarwal, Amit; Okamoto, Daichi; Kubo, Atsushi; Liu, Fuhan; Kathaperumal, Mohan; Tummala, Rao R

sustainable development goals

authors

date/time interval

  • May 29, 2019 -

publication date

  • January 1, 2019

webpage

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • High-bandwidth
  • IO density
  • Science & Technology
  • Technology
  • crosstalk
  • data rate
  • fan-out
  • high-speed electrical interconnections
  • interposer
  • microstrip
  • panel-scale processes
  • polymer dielectrics
  • transmission lines
  • wiring

Location

  • Las Vegas, NV

Digital Object Identifier (DOI)

Conference

  • 69th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 718

end page

  • 725