Modeling, Design and Demonstration of Multi-Die Embedded WLAN RF Front-End Module with Ultra-miniaturized and High-performance Passives Conference

Sitaraman, Srikrishna, Suzuki, Yuya, White, Christopher et al. (2014). Modeling, Design and Demonstration of Multi-Die Embedded WLAN RF Front-End Module with Ultra-miniaturized and High-performance Passives . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1264-1271.

Industry Collaboration International Collaboration

cited authors

  • Sitaraman, Srikrishna; Suzuki, Yuya; White, Christopher; Nair, Vijay; Kamgaing, Telesphor; Juskey, Frank; Kim, Sung Jin; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1264

end page

  • 1271