Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect Conference

Bandyopadhyay, T, Mehrotra, G, Iyer, MK et al. (2008). Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect . 1242-1248. 10.1109/ECTC.2008.4550134

cited authors

  • Bandyopadhyay, T; Mehrotra, G; Iyer, MK; Raj, PM; Swaminathan, M; Tummala, RR

authors

abstract

  • This paper presents design and characterization of Nano-Cu based ultra-fine pitch chip-to-package interconnects for microwave frequencies. Transitions are designed with this new interconnect and characterized upto 40 GHz in Packaging configurations such as Chip-on-Chip and Chip-on-Package. © 2008 IEEE.

publication date

  • September 15, 2008

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 1242

end page

  • 1248