Bandyopadhyay, T, Mehrotra, G, Iyer, MK
et al. (2008). Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect
.
1242-1248. 10.1109/ECTC.2008.4550134
Bandyopadhyay, T, Mehrotra, G, Iyer, MK et al. (2008). Microwave design & characterization of a novel nano-Cu based ultra-fine pitch chip-to-package interconnect
. 1242-1248. 10.1109/ECTC.2008.4550134