Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect Conference

Bandyopadhyay, Tapobrata, Mehrotra, Gaurav, Iyer, Mahadevan K et al. (2008). Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect . 1242-+. 10.1109/ECTC.2008.4550134

Industry Collaboration International Collaboration

cited authors

  • Bandyopadhyay, Tapobrata; Mehrotra, Gaurav; Iyer, Mahadevan K; Raj, PM; Swaminathan, Madhavan; Tummala, Rao R

authors

date/time interval

  • January 1, 2008 -

publication date

  • January 1, 2008

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • FL, Orlando

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • 58th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1242

end page

  • +