Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications Conference

Min, Junki, Wu, Zihan, Pulugurtha, Markondeya Raj et al. (2016). Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications . 1297-1302. 10.1109/ECTC.2016.310

cited authors

  • Min, Junki; Wu, Zihan; Pulugurtha, Markondeya Raj; Smet, Vanessa; Sundaram, Venky; Tummala, Rao; Ravindran, Arjun; Hoffmann, Christian

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

keywords

  • Double-side assembly
  • Embedded passives
  • Engineering
  • Engineering, Electrical & Electronic
  • Glass substrate
  • RF module
  • Science & Technology
  • TPV
  • Technology
  • component

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 1297

end page

  • 1302