Adhesion and Reliability of Direct Cu Metallization of Through-Package Vias in Glass Interposers Conference

Huang, Timothy, Sundaram, Venky, Raj, P Markondeya et al. (2014). Adhesion and Reliability of Direct Cu Metallization of Through-Package Vias in Glass Interposers . 2266-2270.

cited authors

  • Huang, Timothy; Sundaram, Venky; Raj, P Markondeya; Sharma, Himani; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 2266

end page

  • 2270