Analysis Of System-Level Reliability Of Single-Chip Glass BGA Packages With Advanced Solders And Polymer Collars Conference

Jayaram, Vidya, McCann, Scott, Singh, Bhupender et al. (2017). Analysis Of System-Level Reliability Of Single-Chip Glass BGA Packages With Advanced Solders And Polymer Collars . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1405-1412. 10.1109/ECTC.2017.319

Industry Collaboration International Collaboration

cited authors

  • Jayaram, Vidya; McCann, Scott; Singh, Bhupender; Pulugurtha, Raj; Smet, Vanessa; Tummala, Rao; Matsuura, Hiro; Takagi, Yutaka

authors

date/time interval

  • May 30, 2017 -

publication date

  • January 1, 2017

published in

keywords

  • DROP IMPACT RELIABILITY
  • Engineering
  • Engineering, Electrical & Electronic
  • JOINT
  • Science & Technology
  • Technology
  • doped solders
  • finite-element simulation
  • glass BGA packages
  • polymer collars
  • system-level reliability
  • thermal cycling test

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • IEEE 67th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1405

end page

  • 1412